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Hot-melt adhesive film for electronic FFC

Designed for consumer electronics, the high-performance hot melt adhesive film has excellent adhesive strength, flexibility, high temperature resistance, and excellent cost-effectiveness.

Main Features:

High adhesive strength, suitable for a wide range of substrates
Excellent flexibility and bending resistance
Excellent high-temperature resistance, adaptable to harsh environments
High insulation ensures signal transmission stability
UL Flame Retardant (VTM-0) and RoHS compliant

Commodity name： Hot-melt adhesive film for electronic FFC

Category:

Insulation Film

Email:

leary.ir@leary.com.cn

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Leading institutions prioritize sectors with strong technological substitution potential in critical areas like semiconductor manufacturing, display technology, and electronics. They favor civilian-market applications with high industry disruption, including low-domestication-rate premium chemicals (e.g., semiconductor materials, display materials) and emerging fields aligned with global technological trends (e.g., solid-state batteries, synthetic biology).